11-Mercaptoundecanamide

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For Research Use Only | Not For Clinical Use

CAT	AP139041922
CAS	139041-92-2
MDL Number	MFCD18642200
Molecular Weight	217.37
InChI Key	LBHLMQVBCVDGID-UHFFFAOYSA-N

Description	97%
Assay	97%
MP	88-94 °C
Size	100MG
Storage Conditions	2-8°C

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Case Study

11-Mercaptoundecanamide for the Preparation of Mixed Thiolate Self-Assembled Monolayers and Metal-Functionalized Surfaces

Zhang, Yi C., and David Y. Lee. Langmuir 34.44 (2018): 13387-13394.

11-Mercaptoundecanamide (11-MUA) was utilized to fabricate thiolate self-assembled monolayers (SAMs) with metal-functionalized surfaces. The experimental procedure was conducted as follows:
1. Substrate Preparation: Au(111)-on-mica substrates were deposited under cryo-pumped conditions (<10⁻⁹ Torr) to achieve a thickness of ~1200 Å, monitored via quartz crystal microbalance. Films were annealed using a hydrogen flame prior to use.
2. SAM Formation: Substrates were immersed in 1 mL ethanol containing 4 mM 11-MUA or a mixture of 11-MUA and 1-octanethiol. Incubation was performed at 75 °C for 2 h, allowing the thiol molecules to assemble into a dense monolayer. Samples were rinsed with ethanol and air-dried.
3. Porphyrin Functionalization: SAM-coated substrates were immersed in a 5 × 10⁻⁶ M porphyrin solution in toluene and incubated at 47 °C for 60-150 min to allow intercalation of porphyrin molecules among SAM domains.
4. Secondary Solvent Treatment: Samples were sequentially incubated in porphyrin solution in ethanol at 75 °C, 47 °C, and finally at room temperature to ensure uniform metal exposure. Substrates were rinsed with ethanol and air-dried.
5. Characterization: The resulting surfaces were analyzed by scanning tunneling microscopy (STM), confirming nm-scale uniformity, stable SAM coverage, and the simultaneous exposure of 11-MUA amide groups and metal centers.
This stepwise procedure demonstrates that 11-MUA enables straightforward fabrication of hybrid monolayers suitable for surface catalysis, sensor development, and molecular electronics, without the need for vacuum deposition or lithography.

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