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3D printing copper ink

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For Research Use Only | Not For Clinical Use
CATLS71545
Size5ML
Storage Conditions2-8°C
1

Electroless Deposition-Assisted 3D Printing of Micro Circuitries for Structural Electronics

Sanghyeon Lee, Muhammad Wajahat, Jung Hyun Kim, Jaeyeon Pyo, Won Suk Chang, Sung Ho Cho, Ji Tae Kim, Seung Kwon Seol

ACS Appl Mater Interfaces. 2019 Feb 20;11(7):7123-7130.

PMID: 30681321

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Multi-Material Direct Ink Writing (DIW) for Complex 3D Metallic Structures With Removable Supports

Chao Xu, Bronagh Quinn, Louis Laberge Lebel, Daniel Therriault, Gilles L'Espérance

ACS Appl Mater Interfaces. 2019 Feb 27;11(8):8499-8506.

PMID: 30689948

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