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Deciphering Ligands' Interaction With Cu and Cu2O Nanocrystal Surfaces by NMR Solution Tools

Arnaud Glaria, Jérémy Cure, Kilian Piettre, Yannick Coppel, Cédric-Olivier Turrin, Bruno Chaudret, Pierre Fau

Chemistry. 2015 Jan 12;21(3):1169-78.

PMID: 25394357

Abstract:

The hydrogenolysis of [Cu2{(iPrN)2(CCH3)}2] in the presence of hexadecylamine (HDA) or tetradecylphosphonic acid (TDPA) in toluene leads to 6-9 nm copper nanocrystals. Solution NMR spectroscopy has been used to describe the nanoparticle surface chemistry during the dynamic phenomenon of air oxidation. The ligands are organized as multilayered shells around the nanoparticles. The shell of ligands is controlled by both their intermolecular interactions and their bonding strength on the nanocrystals. Under ambient atmosphere, the oxidation rate of colloidal copper nanocrystals closely relies on the chemical nature of the employed ligands (base or acid). Primary amine molecules behave as soft ligands for Cu atoms, but are even more strongly coordinated on surface Cu(I) sites, thus allowing a very efficient corrosion protection of the copper core. On the contrary, the TDPA ligands lead to a rapid oxidation rate of Cu nanoparticles and eventually to the re-dissolution of Cu(II) species at the expense of the nanocrystals.

Chemicals Related in the Paper:

Catalog Number Product Name Structure CAS Number Price
AP4671754 Tetradecylphosphonic acid Tetradecylphosphonic acid 4671-75-4 Price
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