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Decomposition of 1,1-dimethyl-1-silacyclobutane on a Tungsten Filament--Evidence of Both Ring C-C and Ring Si-C Bond Cleavages

Decomposition of 1,1-dimethyl-1-silacyclobutane on a Tungsten Filament--Evidence of Both Ring C-C and Ring Si-C Bond Cleavages

L Tong, Y J Shi

J Mass Spectrom. 2010 Feb;45(2):215-22.

PMID: 20049692

Abstract:

The decomposition of 1,1-dimethyl-1-silacyclobutane (DMSCB) on a heated tungsten filament has been studied using vacuum ultraviolet laser single photon ionization time-of-flight mass spectrometry. It is found that the decomposition of DMSCB on the W filament to form ethene and 1,1-dimethylsilene is a catalytic process. In addition, two other decomposition channels exist to produce methyl radicals via the Si-CH(3) bond cleavage and to form propene (or cyclopropane)/dimethylsilylene. It has been demonstrated that both the formation of ethene and that of propene are stepwise processes initiated by the cleavage of a ring C-C bond and a ring Si-C bond, respectively, to form diradical intermediates, followed by the breaking of the remaining central bonds in the diradicals. The formation of ethene via an initial cleavage of a ring C-C bond is dominant over that of propene via an initial cleavage of a ring Si-C bond. When the collision-free condition is voided, secondary reactions in the gas-phase produce various methyl-substituted 1,3-disilacyclobutane molecules. The dominant of all is found to be 1,1,3,3-tetramethyl-1,3-disilacyclobutane originated from the dimerization of 1,1-dimethylsilene.

Chemicals Related in the Paper:

Catalog Number	Product Name	Structure	CAS Number	Price
AP3449261	1,1,3,3-Tetramethyl-1,3-diphenyldisilazane		3449-26-1	Price

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