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Design of a New, Multi-Purpose, Light-Curing Adhesive Comprising a Silane Coupling Agent, Acidic Adhesive Monomers and Dithiooctanoate Monomers for Bonding to Varied Metal and Dental Ceramic Materials

Design of a New, Multi-Purpose, Light-Curing Adhesive Comprising a Silane Coupling Agent, Acidic Adhesive Monomers and Dithiooctanoate Monomers for Bonding to Varied Metal and Dental Ceramic Materials

Kunio Ikemura, Hisaki Tanaka, Toshihide Fujii, Mikito Deguchi, Noriyuki Negoro, Takeshi Endo, Yoshinori Kadoma

Dent Mater J. 2011;30(4):493-500.

PMID: 21778601

Abstract:

A newly designed, light-curing adhesive was investigated for its bonding effectiveness to porcelain, alumina, zirconia, Au, Au alloy, Ag alloy, Au-Ag-Pd alloy, and Ni-Cr alloy. Four experimental adhesives were prepared using varying contents of the following: a silane coupling agent [3-methacryloyloxypropyltriethoxysilane (3-MPTES)], acidic adhesive monomers [6-methacryloyloxyhexyl phosphonoacetate(6-MHPA),6-methacryloyloxyhexyl3-phosphonopropionate(6-MHPP)and 4-methacryloyloxyethoxycarbonylphthalic acid (4-MET)], and dithiooctanoate monomers [6-methacryloyloxyhexyl 6,8-dithiooctanoate (6-MHDT) and 10-methacryloyloxydecyl 6,8-dithiooctanoate (10-MDDT)]. After all adherend surfaces were sandblasted and applied with an experimental adhesive, shear bond strengths (SBSs) of a light-curing resin composite (Beautifil II, Shofu Inc., Kyoto, Japan) to the adherend materials after 2,000 times of thermal cycling were measured. For the experimental adhesive which contained 3-MPTES (30.0 wt%), 6-MHPA (1.0 wt%), 6-MHPP (1.0 wt%), 4-MET (1.0 wt%), 6-MHDT (0.5 wt%) and 10-MDDT (0.5 wt%), it consistently yielded the highest SBS for all adherend surfaces in the range of 20.8 (4.8)-30.3 (7.9) MPa, with no significant differences among all the adherend materials (p>0.05). Therefore, the newly designed, multi-purpose, light-curing adhesive was able to deliver high SBS to all the adherend materials tested.

Chemicals Related in the Paper:

Catalog Number	Product Name	Structure	CAS Number	Price
AP3386650	Palladium(II) propionate		3386-65-0	Price

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