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Electroless Cu Plating on Anodized Al Substrate for High Power LED

Electroless Cu Plating on Anodized Al Substrate for High Power LED

Sa-Kyun Rha, Youn-Seoung Lee

J Nanosci Nanotechnol. 2015 Mar;15(3):2422-6.

PMID: 26413680

Abstract:

Area-selective copper deposition on screen printed Ag pattern/anodized Al/Al substrate was attempted using a neutral electroless plating processes for printed circuit boards (PCBs), according to a range of variation of pH 6.5-pH 8 at 70 °C. The utilized basic electroless solution consisted of copper(II) sulfate pentahydrate, sodium phosphinate monohydrate, sodium citrate tribasic dihydrate, ammonium chloride, and nickel(II) sulfate hexahydrate. The pH of the copper plating solutions was adjusted from pH 6.5 to pH 8 using NH4OH. Using electroless plating in pH 6.5 and pH 7 baths, surface damage to the anodized Al layer hardly occurred; the structure of the plated Cu-rich films was a typical fcc-Cu, but a small Ni component was co-deposited. In electroless plating at pH 8, the surface of the anodized Al layer was damaged and the Cu film was composed of a lot of Ni and P which were co-deposited with Cu. Finally, in a pH 7 bath, we can make a selectively electroless plated Cu film on a PCB without any lithography and without surface damage to the anodized Al layer.

Chemicals Related in the Paper:

Catalog Number	Product Name	Structure	CAS Number	Price
AP7785208	Ammonium nickel(II) sulfate hexahydrate		7785-20-8	Price

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