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Encapsulation of Nonmetallic Fractions Recovered From Printed Circuit Boards Waste With Thermoplastic

Encapsulation of Nonmetallic Fractions Recovered From Printed Circuit Boards Waste With Thermoplastic

Shantha Kumari Muniyandi, Johan Sohaili, Azman Hassan

J Air Waste Manag Assoc. 2014 Sep;64(9):1085-92.

PMID: 25283006

Abstract:

The present work includes a process for encapsulation by combining substantially simultaneously dry nonmetallic printed circuit boards (PCBs) powder and recycled high-density polyethylene (rHDPE) in an extruder to form a homogenous matrix. The extruded materials were then molded into standard tensile, flexural, and impact properties testing specimens. Nonmetallic PCB mainly consists of large amount of glass fiber-reinforced epoxy resin materials. Incorporation of 50 wt% nonmetallic PCB in rHDPE matrix had increased the flexural strength and modulus by 35% and 130%, respectively. Tensile strength reported to be constant without much improvement. However, the Young's modulus has increased by 180%, with incorporation of 50 wt% nonmetallic PCB. The addition of 6 phr (parts per hundred) maleated polyethylene (MAPE) resulted in 2-fold increase in tensile and flexural strength. Regarding the leaching properties, Cu was identified as the metal that leached at the highest level from the raw nonmetallic PCB, at 59.09 mg/L. However, after the nonmetallic PCB was filled in rHDPE/PCB composites, the concentration of Cu was reduced far below the regulatory limit, to only 3 mg/L. Thermal properties of composites were studied, and it was found out that incorporation of nonmetallic PCB fillers in rHDPE resulted in low thermal conductivity, whereas mechanical strength of the composites showed maximum improvements at 220 degrees C. Overall, the encapsulation technique using nonmetallic PCB waste has formed a monolithic waste form that provides a barrier to the dispersion of wastes into the environment. Implications: Nonmetallic materials reclaimed from waste PCBs were used to analyze the chemical composition, and it was found that nonmetalllic PCBs mainly consist of glass fiber-reinforced epoxy resin materials. With such millions of glass fibers in nonmetallic PCBs, there are mass-excellent supporting bodies that enhance the mechanical properties of composites. In fact, utilization of nonmetallic PCB waste as filler in composites can dramatically restrain the solubility of heavy metals in leachate solution, thus making it safe to be used in practical products.

Chemicals Related in the Paper:

Catalog Number	Product Name	Structure	CAS Number	Price
AP35065293-B	PCB No 180 solution		35065-29-3	Price

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