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Flexible Nonstick Replica Mold for Transfer Printing of Ag Ink

Flexible Nonstick Replica Mold for Transfer Printing of Ag Ink

Bong Kuk Lee, Han Young Yu, Yarkyeon Kim, Yong Sun Yoon, Won Ik Jang, Lee-Mi Do, Ji-Ho Park, Jaehoon Park

J Nanosci Nanotechnol. 2016 Mar;16(3):2682-6.

PMID: 27455689

Abstract:

We report the fabrication of flexible replica molds for transfer printing of Ag ink on a rigid glass substrate. As mold precursors, acrylic mixtures were prepared from silsesquioxane-based materials, silicone acrylate, poly(propylene glycol) diacrylate, 3,3,4,4,5,5,6,6,7,7,8,8, 9,9,10,10,10-heptadecafluorodecyl methacrylate, and photoinitiator. By using these materials, the replica molds were fabricated from a silicon master onto a flexible substrate by means of UV-assisted molding process at room temperature. The wettability of Ag ink decreased with increase in the water contact angle of replica molds. On the other hand, the transfer rate of Ag ink onto adhesive-modified substrates increased with increase in the water contact angle of replica molds. Transferred patterns were found to be thermally stable on the photocurable adhesive layer, whereas Ag-ink patterns transferred on non-photocurable adhesives were distorted by thermal treatment. We believe that these characteristics of replica molds and adhesives offer a new strategy for the development of the transfer printing of solution-based ink materials.

Chemicals Related in the Paper:

Catalog Number	Product Name	Structure	CAS Number	Price
AP1996889	3,3,4,4,5,5,6,6,7,7,8,8,9,9,10,10,10-Heptadecafluorodecyl methacrylate		1996-88-9	Price

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