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Laser-Induced Silver Seeding on Filter Paper for Selective Electroless Copper Plating

Laser-Induced Silver Seeding on Filter Paper for Selective Electroless Copper Plating

Chang-Chun Liu, Jin Cheng, Xiao-Qiang Li, Zhi-Jie Gu, Kenji Ogino

Materials (Basel). 2018 Aug 3;11(8):1348.

PMID: 30081460

Abstract:

The generation of a flexible printed circuit board on polymer fabrics has been a challenge over the last decade. In this work, a copper pattern was obtained on a soft substrate of filter paper/polyacrylonitrile (FP/PAN) film, where the filter paper was commercially available. The pattern of Ag particles was first produced on an Ag⁺-doped FP/PAN composite film, followed by electroless plating of copper using the metal silver particles as seeds. The in situ reduction of silver particles and the formation of the silver agglomeration pattern were induced by laser irradiation technology on the FP/PAN/AgNO₃ composite film. A variety of characterizations indicated that the resultant copper deposition was uniform, with good conductivity properties.

Chemicals Related in the Paper:

Catalog Number	Product Name	Structure	CAS Number	Price
IAR42111	Metals on Filter Paper			Price

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