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Electroless Deposition-Assisted 3D Printing of Micro Circuitries for Structural Electronics

Electroless Deposition-Assisted 3D Printing of Micro Circuitries for Structural Electronics

Sanghyeon Lee, Muhammad Wajahat, Jung Hyun Kim, Jaeyeon Pyo, Won Suk Chang, Sung Ho Cho, Ji Tae Kim, Seung Kwon Seol

ACS Appl Mater Interfaces. 2019 Feb 20;11(7):7123-7130.

PMID: 30681321

Abstract:

Three-dimensional (3D) printing is a next-generation free-form manufacturing technology for structural electronics. The realization of structural electronic devices necessitates the direct integration of electronic circuits into 3D objects. However, creating highly conductive, high-resolution patterns in 3D remains a major challenge. Here, we report on a metallic 3D printing method that incorporates electroless deposition (ELD) into the direct ink writing method. Our approach consists of two steps: (1) direct ink writing of catalyst microstructures with a functional catalyst ink containing Ag ions and (2) ELD of Cu onto the printed catalyst structures. High-quality, stable Cu 3D printing is achieved through the design of the Ag catalyst ink; hydroxypropyl cellulose is added as both a rheological modifier (printing) and dissolution inhibitor (ELD). As a result, various two-dimensional (2D) and 3D Cu micro circuitries with high conductivity (∼65% of bulk) can be directly integrated onto 3D plastic substrates without the need for high-temperature annealing. A hybrid strategy that combines ELD-assisted 3D printing and conventional fused deposition modeling enables full fabrication of structural electronic devices. This 3D printing strategy can be a low-cost and facile method for obtaining highly conductive metallic 2D and 3D microstructures in structural electronics.

Chemicals Related in the Paper:

Catalog Number	Product Name	Structure	CAS Number	Price
LS71545	3D printing copper ink			Price

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